logo_imdes=creative=solutions.jpg (141872 Byte) Tin Lead Printing Solder Paste

for the Professional, Radio Amateur, Maker & Electronic Hobbyist

 

We pioneer creative reflow soldering solutions that brings your electronic production to a higher quality level !

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COBAR SOLDER PASTE S62 XF3+
Sn62 Pb 36 Ag2


F3+ solder paste series provides a full range of Pb-free and Pb containing solder alloys to be used with this flux technology. F3+ is a halide-free, no-clean solder paste with a long stencil life and high tack force. Standard available alloys are S62, SN100C, SAC305 and SCANGe. The SCANGe alloys have a melting range of 8-11C, which provides extremely good anti-tombstoning behavior. The low levels of Ag (compared to the SAC305 alloy) combined with the micro additions of Ni and Ge result in fine grain structures and stabilizes Inter Metallic Compounds (IMC).
The same flux technology is used for both Pb-free and SnPb alloys, which makes qualifications easier.
IPC J-STD-004 classification REL0
See the Material Safety Data Sheet (MSDS) before handling and/or using this product.

Physical and chemical properties

 

Flux code

F3+

Particle size code

X

Alloy code SAC3

S62

Alloy type

Sn62Pb36Ag2

Liquidus [C] - SAC3

179

Liquidus [C] - SCAN-Ge

179

Recommended peak temp. [C]

205-225

Particle size [m]

25-45

Oxide content powder [ppm]

100.

Acid number [mgKOH] (+/-2.5%)

124.30

Halides [Potentiometric]

Pass

Halides [Silver-Chromate Test]

Pass

Flux [% w/w]

10.61

Metal [% w/w]

89.39

Filmformer(s)

Resin

Color of the residue

Colorless

Viscosity @25 C [Pa's] Plate/Plate (+/-18%)

190

Viscosity @ 25C [Pa's] Malcom PCU205 (+/-18%)

180

Max. print speed [mm/sec]

100

Rec.separation speed [mm/sec]

10.

Tackiness time 20C/ 70%RH [H]

24.

Tackiness force Malcom TK1 [gr]

110.

Telcordia/Bellcore TR-NWT-000078/3

Compliant

IPC/ANSI-J-STD-0D5

Compliant

Test report(s)

Available

Certificate of Compliance

Available

Environmental Load Unit 1.00

5.00

RoHS-Compliance Certificate

Not available

User's Guidelines

English

Packaging

Jar (PP) [gram]

500

Small cartridge (HDPE) [gram]

650

Large cartridge (HDPE) [gram]

1300

Cassette (HDPE) [gram]

850

Shelf-life (Weeks)

Storage 4-10 [C]

25

Storage 25 [C]

6

Fields of Applications

5

Especially made for this purpose

4

Generally qualified for this purpose

3

Generally usable, but not the best choice

2

Generally not usable for this purpose

1

Wrong choice

 

Application

S62

ISO 9454-1

1.2.3.C

JIS Z3284

1.2.3.N_1

IPC-ANSI-J-STD-004 (Flux)

REL0

IPC-ANSI-J-STD-005 (Powder)

3.

No-Clean Process

5

Post-solder cleaning

3

Pb-Free process - Air, Standard

1

Pb-Free process - Air, Extended

1

Pb-Free process - N

1

Vapor Phase

4

Consumer electronics

5

Med-Rel electronics

5

Hi-Rel electronics

4

1-layer, video/tv boards

-

2-layer boards

-

Multi-layer boards

-

OSP compatible

5

Ni/Au compatible

5

Ni/Pd compatible

4

Ag compatible

5

Sn compatible

5

Squeegee

5

Closed Printhead (Proflow etc)

3

Dispensing [> awg 22]

3

Short cycle time

5

Long stencil-life

5

Long open time

5

Sharp print definition

5

Reduces dog ears

4

Reduces smearing

5

Reduces stencil wiping

4

Reduces solder balling

4

Reduces solder beading

4

Reduces bridging

5

Reduces tombstoning

4

Reduces de-wetting

5

Reduces slumping

5

Reduces voiding

5

Brilliant joint appearance

5

Cosmetic cleanliness

4

Reduces flux build-up in reflow oven

4

ICCT compatible

5

Conformal coating

4

 

 

Data Sheets Download

 application/pdf PDS Solder Paste Cobar-F3+

 application/pdf AN 262-XF3+ GB.pdf

Chemical product, please refer to material safety data sheet before use.

 application/pdf   SDB-26 GB.pdf

 

Die Firma IMDES ist nicht MwST pflichtig !
Kleinunternehmerregelung nach 19 abs. 1 UStG

 

 

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For more information:

T: +49(0)5924-997337  F: +49(0)5924-997338  Mobile: +(0)1577-3326123

E: info@imdes.de        dk4dds@t-online.de

Skype: marc.van.stralen

Last Update: 21.07.2015

IMDES (c) copyright 2015